The PIN3S project covers Process Integration, creation of Lithography Equipment, EUV Mask Repair Equipment and Metrology tools capable to deal with 3D structures, defects analysis, overlay and feature size evaluation.
IBS partners with IMEC to develop new doping and material modification processes using the PULSION HP tool to improve the electrical performance and allow easier process integration of 3nm advanced devices (GAA and Nano-sheet based devices).
Project website
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